Change search
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf
Numerical and experimental studies of fabrication-induced thermal residual stresses in microelectronic packages
Iran University of Science and Technology, Iran; Politecnico di Milano, Italy.
RISE Research Institutes of Sweden, Digital Systems, Smart Hardware.ORCID iD: 0000-0002-3548-547X
Iran University of Science and Technology, Iran.
2021 (English)In: IEEE Transactions on Components, Packaging, and Manufacturing Technology, ISSN 2156-3950, E-ISSN 2156-3985, Vol. 11, no 5, p. 755-764Article in journal (Refereed) Published
Abstract [en]

Microelectronic packages are typically composed of different layers of materials with un-similar thermo-mechanical properties. Fabrication-induced residual stresses, resulting from the mismatch of layers’ thermo-mechanical properties, may lead to adverse effects such as warpage and delamination at the interface of layers. In this study, the fabrication process of the ball grid array (BGA) package was simulated to predict the thermal residual stresses through the thickness of the package. A finite element model incorporating realistic material behavior of the BGA package layers was developed. To this end, the epoxy molding compound (EMC) was modeled as a viscoelastic material, while the silicon chip, the die-attach, and the composite substrate were simulated using an elastic model during cooling. Since Young’s modulus of EMC is time and temperature-dependent, three different process temperatures were simulated to investigate the impact of viscoelastic properties of EMC, defined using Prony coefficients, on numerical residual stresses. To verify the simulation results, the incremental hole-drilling method was used to experimentally measure the residual stress components. It includes drilling a small hole at the center of a rosette strain gauge bonded on the BGA package surface and measuring the released strains on the surface. The relaxed strains were then converted to the residual stresses using a calibration matrix whose coefficients are determined from a finite element model. The reasonable agreement of numerical and experimental components of the residual stress throughout the thickness of the BGA package confirms the reliability of the proposed simulation approach in estimating residual stresses in microelectronics packages. 

Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers Inc. , 2021. Vol. 11, no 5, p. 755-764
Keywords [en]
Electromagnetic compatibility, Finite element analysis, hole drilling method, Microelectronic packages, Microelectronics, Numerical models, Residual stresses, Strain, Stress measurement, thermal residual stresses, viscoelastic behavior, Ball grid arrays, Boreholes, Dies, Elasticity, Electronics packaging, Fabrication, Infill drilling, Strain gages, Viscoelasticity, Ball grid array packages, Epoxy molding compounds, Incremental hole drilling method, Microelectronic package, Microelectronics packages, Numerical and experimental study, Thermomechanical properties, Viscoelastic properties, Finite element method
National Category
Applied Mechanics
Identifiers
URN: urn:nbn:se:ri:diva-53068DOI: 10.1109/TCPMT.2021.3070893Scopus ID: 2-s2.0-85103919315OAI: oai:DiVA.org:ri-53068DiVA, id: diva2:1557142
Available from: 2021-05-25 Created: 2021-05-25 Last updated: 2023-10-30Bibliographically approved

Open Access in DiVA

No full text in DiVA

Other links

Publisher's full textScopus

Authority records

Akbari, Saeed

Search in DiVA

By author/editor
Akbari, Saeed
By organisation
Smart Hardware
In the same journal
IEEE Transactions on Components, Packaging, and Manufacturing Technology
Applied Mechanics

Search outside of DiVA

GoogleGoogle Scholar

doi
urn-nbn

Altmetric score

doi
urn-nbn
Total: 8 hits
CiteExportLink to record
Permanent link

Direct link
Cite
Citation style
  • apa
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Other style
More styles
Language
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Other locale
More languages
Output format
  • html
  • text
  • asciidoc
  • rtf