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Experimental and finite element simulated box compression tests on paperboard packages at different moisture levels
RISE Research Institutes of Sweden, Bioeconomy and Health, Pulp, Paper and Packaging.ORCID iD: 0000-0001-7356-1093
RISE Research Institutes of Sweden, Bioeconomy and Health, Pulp, Paper and Packaging.
BillerudKorsnäs, Sweden.ORCID iD: 0000-0002-9689-5966
KTH Royal Institute of Technology, Sweden.
2021 (English)In: Packaging technology & science, ISSN 0894-3214, E-ISSN 1099-1522, Vol. 34, no 4, p. 229-243Article in journal (Refereed) Published
Abstract [en]

Finite element (FE) analyses can be used as a powerful tool in the package design process to study for instance stress and strain fields that arise during loading. An orthotropic linear elastic material model with a stress-based failure criterion was used to simulate box compression tests (BCTs) of a paperboard package in the FE solver LS-Dyna. Physical experiments were performed at 50%, 70%, and 90% relative humidity (RH). The input parameters required for the simulations were calculated based on material characterization at standard climate (50% RH and 23°C) and a linear relation between mechanical material properties and moisture ratio established in earlier studies. The result showed that it was possible to accurately predict the load–compression curve of a BCT when moisture was accounted for. Furthermore, it was found that modelling of the mechanical properties of the creases are important for capturing the stiffness response of the package. To conclude, it was possible to predict the box compression strength and the linear stiffness response prior to the peak in the load–compression response at relevant moisture levels, by using the previously established linear relationship between moisture ratio and material properties. In addition to the moisture ratio at the preferred moisture level, the only material properties required were the in-plane strengths and stiffnesses, and the out-of-plane shear moduli at standard climate. 

Place, publisher, year, edition, pages
John Wiley and Sons Ltd , 2021. Vol. 34, no 4, p. 229-243
Keywords [en]
box compression test, FE simulations, material characterization, moisture, paperboard, Compression testing, Finite element method, Moisture determination, Paperboards, Stiffness, Stress analysis, Box compression tests, Compression strength, Linear elastic material, Linear relationships, Material characterizations, Mechanical material properties, Physical experiments, Stress-based failure criterion
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Natural Sciences
Identifiers
URN: urn:nbn:se:ri:diva-51933DOI: 10.1002/pts.2554Scopus ID: 2-s2.0-85099099929OAI: oai:DiVA.org:ri-51933DiVA, id: diva2:1520182
Note

Funding text 1: This work has been granted funding by STFIs Intressentförening (STFIs Association of Interested Parties) through the following project: To understand the relation between board properties and package performance.

Available from: 2021-01-20 Created: 2021-01-20 Last updated: 2023-11-01Bibliographically approved

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Marin, GustavNygårds, Mikael

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