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Double sided bulk micromachining of SOI films using room temperature oxygen plasma assisted bonding,
RISE, Swedish ICT, SICS, Imego.
RISE, Swedish ICT, SICS, Imego.ORCID iD: 0000-0001-6637-9859
2002 (English)In: Proceedings Volume 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002; (2002), 2002Conference paper (Refereed)
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2002.
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Electrical Engineering, Electronic Engineering, Information Engineering
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URN: urn:nbn:se:ri:diva-25201DOI: 10.1117/12.462867OAI: oai:DiVA.org:ri-25201DiVA, id: diva2:1132646
Available from: 2018-07-02 Created: 2016-10-31 Last updated: 2020-12-01Bibliographically approved

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Andersson, Gert

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