Ändra sökning
RefereraExporteraLänk till posten
Permanent länk

Direktlänk
Referera
Referensformat
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Annat format
Fler format
Språk
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Annat språk
Fler språk
Utmatningsformat
  • html
  • text
  • asciidoc
  • rtf
Investigation on thermal fatigue of SnAgCu, Cu100C, and SnPbAg solder joints in varying temperature environments
Saab, Sweden.
Jönköping University, Sweden.
RISE., SP – Sveriges Tekniska Forskningsinstitut, SP Sveriges tekniska forskningsinstitut, SP – Sveriges Tekniska Forskningsinstitut / Hållfasthet (BMh).ORCID-id: 0000-0001-7182-0872
Fraunhofer, Germany.
Visa övriga samt affilieringar
2014 (Engelska)Ingår i: Microelectronics Reliability, Vol. 54, nr 11, s. 2523-2535Artikel i tidskrift (Refereegranskat) Published
Abstract [en]

Thermal cycling tests have been performed for a range of electronic components intended for avionic applications, assembled with SAC305, SN100C and SnPbAg solder alloys. Two temperatureprofiles have been used, the first ranging between -20 °C and +80 °C (TC1), and the second between -55 °C and +125 °C (TC2). High level of detail is provided for the solder alloy composition and the component package dimensions, and statistical analysis, partially supported by FE modeling, is reported. The test results confirm the feasibility of SAC305 as a replacement for SnPbAg under relatively benign thermomechanical loads. Furthermore, the test results serve as a starting point for estimation of damage accumulation in a critical solder joint in field conditions, with increased accuracy by avoiding data reduction. A computationally efficient method that was earlier introduced by the authors and tested on relatively mild temperature environments has been significantly improved to become applicable on extended temperature range, and it has been applied to a PBGA256 component with SAC305 solder in TC1 conditions. The method, which utilizes interpolated response surfaces generated by finite element modeling, extends the range of techniques that can be employed in the design phase to predict thermal fatigue of solder joints under field temperatureconditions.

Ort, förlag, år, upplaga, sidor
2014. Vol. 54, nr 11, s. 2523-2535
Nationell ämneskategori
Naturvetenskap
Identifikatorer
URN: urn:nbn:se:ri:diva-6762DOI: 10.1016/j.microrel.2014.06.007Scopus ID: 2-s2.0-84911421359Lokalt ID: 28154OAI: oai:DiVA.org:ri-6762DiVA, id: diva2:964602
Tillgänglig från: 2016-09-08 Skapad: 2016-09-08 Senast uppdaterad: 2019-08-13Bibliografiskt granskad

Open Access i DiVA

Fulltext saknas i DiVA

Övriga länkar

Förlagets fulltextScopus

Personposter BETA

Johnson, ErlandLeisner, Peter

Sök vidare i DiVA

Av författaren/redaktören
Johnson, ErlandLeisner, Peter
Av organisationen
SP – Sveriges Tekniska Forskningsinstitut / Hållfasthet (BMh)SP Elektronik
Naturvetenskap

Sök vidare utanför DiVA

GoogleGoogle Scholar

doi
urn-nbn

Altmetricpoäng

doi
urn-nbn
Totalt: 15 träffar
RefereraExporteraLänk till posten
Permanent länk

Direktlänk
Referera
Referensformat
  • apa
  • harvard1
  • ieee
  • modern-language-association-8th-edition
  • vancouver
  • Annat format
Fler format
Språk
  • de-DE
  • en-GB
  • en-US
  • fi-FI
  • nn-NO
  • nn-NB
  • sv-SE
  • Annat språk
Fler språk
Utmatningsformat
  • html
  • text
  • asciidoc
  • rtf
v. 2.35.7