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Mutiphysics study of RF/microwave planar devices: Effect of the input signal power
Universite de Bretagne Occidentale.
RISE - Research Institutes of Sweden, Swerea, Swerea IVF AB.
Universite de Bretagne Occidentale.
RISE - Research Institutes of Sweden, Swerea, Swerea IVF AB.ORCID-id: 0000-0002-2232-7835
Vise andre og tillknytning
2014 (engelsk)Inngår i: 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014, IEEE Computer Society , 2014Konferansepaper, Publicerat paper (Fagfellevurdert)
Abstract [en]

In this paper, the effects of the input signal power on microwave planar devices are studied in detail. In this context, a complete multiphysics study is performed, involving the electro-thermo-mechanical coupling in microwave components. For this study, a multiphysics simulator is used. As shown, for moderate input powers, the device transfer function can be altered, mainly in terms of an increase of losses and a frequency shift. Additionally, hot spots are to be appeared, whose location is related to the electromagnetic field distribution of the passive device under test. Guidelines are also provided to estimate the average power handling capability (APHC) of planar components. As an example, the multiphysics analysis of a microstrip coupled-line filter centered at 42 GHz is tackled taken into account different thermal and mechanical boundary conditions. © 2014 IEEE.

sted, utgiver, år, opplag, sider
IEEE Computer Society , 2014.
HSV kategori
Identifikatorer
URN: urn:nbn:se:ri:diva-13402DOI: 10.1109/EuroSimE.2014.6813816Scopus ID: 2-s2.0-84901419510ISBN: 9781479947904 (tryckt)OAI: oai:DiVA.org:ri-13402DiVA, id: diva2:973609
Konferanse
2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014
Tilgjengelig fra: 2016-09-22 Laget: 2016-09-22 Sist oppdatert: 2018-08-20bibliografisk kontrollert

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