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Transgranular crack propagation in thermal cycling of SnAgCu solder joints
RISE - Research Institutes of Sweden, Materials and Production, IVF.ORCID iD: 0000-0002-9505-0822
RISE - Research Institutes of Sweden, Materials and Production, IVF.ORCID iD: 0000-0002-8556-0925
2019 (English)In: 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019, Institute of Electrical and Electronics Engineers Inc. , 2019Conference paper, Published paper (Refereed)
Abstract [en]

Lifetime predictions of lead-free solder joints remain a challenging task in assuring reliability of electronic packaging. Due to the complex interaction of a wide range of as-soldered microstructures, strong an isotropic properties and a failure mechanism that is not completely understood, life time predictions of SnAgCu solder joints remain a challenging task.In this work, we present experimental findings of transgranular crack propagation of SnAgCu solder joints in thermal cycling. These findings are in contrast with the established picture of a recrystallization-assisted intergranular crack propagation failure mechanism

Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers Inc. , 2019.
Keywords [en]
Copper alloys, Crack propagation, Cracks, Electronics packaging, Failure (mechanical), Microelectronics, Microsystems, Silver alloys, Soldered joints, Ternary alloys, Textures, Thermal cycling, Tin alloys, Electronic Packaging, Failure mechanism, Intergranular crack, Isotropic property, Lead-free solder joint, Lifetime prediction, Propagation failure, Transgranular crack, Lead-free solders
National Category
Natural Sciences
Identifiers
URN: urn:nbn:se:ri:diva-39276DOI: 10.1109/EuroSimE.2019.8724507Scopus ID: 2-s2.0-85067481889ISBN: 9781538680407 (print)OAI: oai:DiVA.org:ri-39276DiVA, id: diva2:1334724
Conference
20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019, 24 March 2019 through 27 March 2019
Note

 Funding details: VINNOVA, 2015-01420; Funding details: Swedish National Space Agency; Funding text 1: This work has been conducted within the Swedish national project "Requirements, specification and verification of environmental protection and life of solder joints to components". Support from the Swedish Governmental Agency for Innovation Systems (Vinnova) under contract 2015-01420 is gratefully acknowledged.

Available from: 2019-07-03 Created: 2019-07-03 Last updated: 2019-07-03Bibliographically approved

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Lövberg, AndreasTegehall, Per-Erik

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