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Vassilev, V., Stoew, B., Blomgren, J. & Andersson, G. (2015). A mm-Wave Sensor for Remote Measurement of Moisture in Thin Paper Layers. IEEE Transactions on Terahertz Science and Technology, 5(5), 770-778, Article ID 7202922.
Open this publication in new window or tab >>A mm-Wave Sensor for Remote Measurement of Moisture in Thin Paper Layers
2015 (English)In: IEEE Transactions on Terahertz Science and Technology, ISSN 2156-342X, E-ISSN 2156-3446, Vol. 5, no 5, p. 770-778, article id 7202922Article in journal (Refereed) Published
Abstract [en]

We present the design and performance of a moisture sensor operating at 200 GHz for remote measurement of water content in paper. The system aims at industrial processes such as offset print and paper production. The moisture content in the paper is derived through an accurate measurement of the loss of a signal transmitted through the paper. The system is designed to achieve high accuracy in the measurement of the loss presented by the paper, not affected by 1/f or drift noise. The sensor is capable of resolving 0.005 dB loss achieving a moisture resolution of 0.1% for moisture content higher than 15%. The resolution can be improved if necessary in exchange for longer measurement times. The sensor is tested in offset print and paper production processes and measured values are compared to laboratory measured samples of the paper.

Place, publisher, year, edition, pages
IEEE Microwave Theory and Techniques Society, 2015
Keywords
Detectors, flicker noise, microwave sensors, millimeter-wave (mm) technology, moisture control, process control, radiometers, Schottky diodes, Millimeter waves, Moisture, Moisture determination, Offset printing, Papermaking, Schottky barrier diodes, Water content, Accurate measurement, Industrial processs, Moisture sensors, Paper production, Paper production process, Remote measurement, Measurement, Moisture Content
National Category
Natural Sciences
Identifiers
urn:nbn:se:ri:diva-42040 (URN)10.1109/TTHZ.2015.2462716 (DOI)2-s2.0-85027928095 (Scopus ID)
Available from: 2019-12-13 Created: 2019-12-13 Last updated: 2019-12-13Bibliographically approved
Sanz-Velasco, A., Rödjegård, H. & Andersson, G. (2002). Double sided bulk micromachining of SOI films using room temperature oxygen plasma assisted bonding,. In: Proceedings Volume 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002; (2002): .
Open this publication in new window or tab >>Double sided bulk micromachining of SOI films using room temperature oxygen plasma assisted bonding,
2002 (English)In: Proceedings Volume 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002; (2002), 2002Conference paper (Refereed)
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:ri:diva-25201 (URN)10.1117/12.462867 (DOI)
Available from: 2018-07-02 Created: 2016-10-31 Last updated: 2018-07-19Bibliographically approved
Identifiers
ORCID iD: ORCID iD iconorcid.org/0000-0001-6637-9859

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