Open this publication in new window or tab >>Show others...
2024 (English)In: 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024, Institute of Electrical and Electronics Engineers Inc. , 2024Conference paper, Published paper (Refereed)
Abstract [en]
To generate data used for developing schemes and models for CM, PHM, and for estimating RUL of power electronic devices, accelerated aging experiments in the form of power cycling are often performed. In these experiments, a set current is passed through the power devices and is turned on and off in regular cycles. Due to the mismatch in CTEs of the materials in the devices, the on/off cycles will generate thermally induced stress in the various material interfaces, which is the main cause of failures. Most of the power cycling setups that are currently used can only manage a single set on-state current level and fixed on/off times (which is also the common standard for lifetime testing); a condition that is very far from most real applications. The experimental setup described here is based on a Gamry Reference 3000AEpotentiostat/galvanostat/ZRA working with a Gamry 30k Booster, which can be programmed to generate a variable load current profile and will thus enable the application of more realistic conditions for accelerated aging of power electronic devices in the lab. This will improve prognostics model development and provide excellent use cases for evaluating the capabilities of the prognostics algorithms for generalization to field conditions. The application of variable load profiles from the field, instead of the regular on/off cycles traditionally used, is not compatible with the commonly used method of using the chip itself as a temperature sensor. Instead, we here present a novel method of estimating the junction temperature using a device specific derivation of thermal parameters from the measured cooling block temperature, case temperature, and dissipated power in conjunction with simulations using the PySpice simulation package implemented in Python. The setup coupled with the new junction temperature estimation is an important step in enabling predictive maintenance of power devices that is currently missing from the power electronics community. © 2024 IEEE.
Place, publisher, year, edition, pages
Institute of Electrical and Electronics Engineers Inc., 2024
Keywords
Computer software; Electronic equipment; Power electronics; Python; Thermoelectric equipment; ’current; Accelerated ageing; Junction temperatures; Mission profile; Power cycling; Power devices; Power electronic devices; Power-electronics; Real-world; Variable loads; Junction temperature
National Category
Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
urn:nbn:se:ri:diva-73256 (URN)10.1109/EuroSimE60745.2024.10491457 (DOI)2-s2.0-85191160586 (Scopus ID)
Conference
25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2024. Catania, Italy. 7 April 2024 through 10 April 2024
Note
The project is partly supported by the Chips Joint Undertaking and its members, including the top-up funding by the national Authorities of Germany, Belgium, Spain, Sweden, Netherlands, Austria, Italy, Greece, Latvia, Finland, Hungary, Romania and Switzerland, under grant agreement number 101096387. Co-funded by European Union. and from the Swedish national funding authority Vinnova. The research is also partly supported by VINNOVA (Swedish Innovation Agency) (2020-05117) and BMBF (16ME0324) through the Trust-E project of Eureka PENTA and EURIPIDES2 programmes.
2024-05-232024-05-232024-08-14Bibliographically approved